To solve the back-chipping in the cutting process of Al2O3 ceramic substrates,four characteristic parameters with significant impact on back chipping during the cutting process with diamond blade were selected as key factors,including abrasive particle size,abrasive concentration,binder hardness and the number of cold water tanks.The back chipping size of ceramic substrates was taken as the response variable.Sample data were selected within the feasible domain of factors by orthogonal experimental design.Gaussian process regression model was used for modeling and particle swarm optimization algorithm was used for optimization.The results show that this method has good guiding significance for the selection of diamond blade with electroplated binder,and the difference between the verification results and the optimization results of the algorithm is only 0.5 µm.
关键词
LED封装/氧化铝陶瓷基板/电镀结合剂/正交试验设计/粒子群优化算法
Key words
LED packaging/Alumina Ceramic substrate/electroplated binder/orthogonal experimental design/particle swarm optimization algorithm