In order to better improve the cutting quality of silicon wafers with narrow blocks,small grains and blocks with different modification materials,this topic discusses the influence of small differences in diamond particle size and particle size distribution width on the cutting quality of sensitive silicon wafers.The cutting wafers are narrow slit silicon wafers with polyamide adhesive on the surface and thin brittle silicon wafers with silicon dioxide passivation layer on the surface.Experiments have shown that a difference of 0.22 μm in diamond abrasive particle size can have a significant impact on the forward and backward breakage of sensitive silicon wafer cutting,as well as the blade wear rate;Narrowing the width of particle size distribution is beneficial for improving normal chip-ping,but it has no significant effect on back chipping;The particle size distribution width is non-linear related to the blade cutting wear rate.
关键词
划片刀/粒度分布/崩口/硅晶圆
Key words
dicing blade/size distribution width/chipping/silicon wafer
维普
万方数据