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自复位SMA丝驱动的连续体孔探弯曲机构设计

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针对孔探仪探头自适应弯曲的需求,设计了一种由形状记忆合金(shape memory alloy,简称SMA)人工肌肉丝驱动的自复位弯曲机构.首先,搭建了 SMA丝的性能测试平台,对不同电流激励下直径为0.8 mm的SMA丝的基本性能进行了测试;其次,设计了 4段弯曲机构,建立其运动学模型,计算并试验测试了 1根SMA丝通电激励下各关节的弯曲角度;最后,分别对单根及2根SMA丝通电,测试对比了机构整体弯曲角度,并利用光纤3D形状传感系统实现了此类机构的形态重构.结果表明:当电流在2.1~3.3 A变化时,SMA丝的收缩率由2.01%增大到4.54%,增加了 2.26倍,在3.3 A电流下SMA丝的恢复应力为200 N;各关节弯曲角度的试验结果与理论值吻合较好;2根SMA丝通电下的机构整体弯曲角度最大可达114°,远大于单根丝的65°,具有良好的实用性.
Design of a Continuous Body Hole-Probing Bending Mechanism Driven by Self-Resetting SMA Filaments
A self-resetting bending mechanism driven by a shape memory alloy(SMA)artificial muscle wire is designed for the adaptive bending of hole detector probes.Firstly,the performance test platform of SMA wire is built,and the basic characteristics of SMA wire with a diameter of 0.8 mm is tested under different currents.Secondly,a 4-segment bending mechanism based on SMA wires is designed,its kinematic model is estab-lished,and the bending angle of each segment under the excitation of a single SMA wire is theoretically calcu-lated and tested.Finally,both a single and two SMA wires are energized respectively and then the overall bend-ing angles of the mechanism are tested and compared with its original shape.Additionally,the shape reconstruc-tion of such mechanisms is achieved using a fiber-optic 3D shape sensing system.The results show that:the shrinkage rate of the SMA wire increases from 2.01%to 4.54%,when the current varies from 2.1 to 3.3 A,which increase by 2.26 times.And the restoring stress of the SMA wire is 200 N at a current of 3.3 A.The test results of the bending angles of the joints match well with the theoretical values.The overall bending angle of the mechanism under energization of the two SMA wires can reach up to 114°,which is much larger than the de-flection angle of 65°achieved with a single wire,showing good practicality.

borescopeself-reset bending mechanismdynamic analysisshape memory alloy drive

王宜耀、芦吉云、崔胜明、左洪福

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南京航空航天大学民航学院 南京,210016

孔探仪 自复位弯曲机构 动力学分析 形状记忆合金驱动

2024

振动、测试与诊断
南京航空航天大学 全国高校机械工程测试技术研究会

振动、测试与诊断

CSTPCD北大核心
影响因子:0.784
ISSN:1004-6801
年,卷(期):2024.44(6)