基于塑封的加速度计无引线键合封装设计
Design of Leadless Bonding Package for Accelerometers Based on Plastic Sealing
焦静静 1段国栋 1任延超 1王鸿睿 1刘甜1
作者信息
- 1. 湖南云箭集团有限公司,湖南长沙 410100
- 折叠
摘要
针对MEMS中传统陶瓷封装造成的封装体积大以及耦合问题,设计了一种基于塑封的加速度计无引线键合封装,该封装通过阳极键合和各向异性导电胶实现无引线封装.对敏感结构进行力学分析,求解敏感结构在量程下的最大振动位移为6.4 μm,从而优化封装结构.阐述基于塑封的加速度计无引线键合封装的工艺路线,经仿真验证,该封装有效缩小了封装尺寸,提高了封装效率,增加了MEMS加速度计封装的可靠性.
Abstract
A lead-free bonding package for accelerometers based on plastic packaging was designed to address the issues of large packaging volume and coupling caused by traditional ceramic packaging in MEMS.The package achieves lead-free packaging through anodic bonding and anisotropic conductive adhesive.Perform mechanical analysis on sensitive structures and determine that the maximum vibration displacement of the sensitive structure at the range is 6.4 μm.Thus optimizing the packaging structure.Elaborate on the process route of lead-free bonding packaging for accelerometers based on plastic packaging.After simulation verification,this packaging effectively reduces the packaging size,improves packaging efficiency,and increases the reliability of MEMS accelerometer packaging.
关键词
微机电系统/加速度计/封装/无引线键合Key words
MEMS/accelerometer/package/wireless bonding引用本文复制引用
出版年
2024
NETL
NSTL
万方数据