Design of Leadless Bonding Package for Accelerometers Based on Plastic Sealing
A lead-free bonding package for accelerometers based on plastic packaging was designed to address the issues of large packaging volume and coupling caused by traditional ceramic packaging in MEMS.The package achieves lead-free packaging through anodic bonding and anisotropic conductive adhesive.Perform mechanical analysis on sensitive structures and determine that the maximum vibration displacement of the sensitive structure at the range is 6.4 μm.Thus optimizing the packaging structure.Elaborate on the process route of lead-free bonding packaging for accelerometers based on plastic packaging.After simulation verification,this packaging effectively reduces the packaging size,improves packaging efficiency,and increases the reliability of MEMS accelerometer packaging.
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