Application of Fully Automatic Loading and Unloading Method in Semiconductor Equipment
In order to achieve a fully automatic loading and unloading method in GPP semiconductor equipment,the system adopts a modular design,which can be conveniently installed on one side of existing processing equipment or used for manual equipment upgrades.The loading and unloading mechanism achieves automatic picking and transportation of wafers through precise coordination of horizontal and vertical motor modules,suction cups,material boxes,and sensors.The control system is based on the Omron CP1H programmable controller,which ensures the stability and safety of the loading and unloading process through built-in input,output,and origin functions.In terms of methods,the fully automatic loading and unloading process includes three main steps:Material retrieval,transmission,and discharge,and introduces a waste removal function to deal with processing abnormalities.The material retrieval process is achieved through precise control of the longitudinal robotic arm,the transmission process relies on accurate driving of the transverse motor,and the material discharge process needs to be closely coordinated with the bearing platform.In addition,the system also provides comprehensive testing functions,covering both single axis testing and process testing,to ensure the performance of the mechanism and control system.Through the application of fully automatic loading and unloading mechanisms and control systems,the material replacement cycle of the equipment has been extended from the traditional 25 pieces to 80～100 pieces,improving production efficiency.The system reduces manual intervention,lowers labor costs,and allows operators to simultaneously consider more equipment.
fully automaticstackedPLCloading and unloading method
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