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类金刚石薄膜的残余应力调控研究进展

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类金刚石薄膜(Diamond-like carbon,DLC)由于其优异的性能而在诸多领域显示出广阔的应用前景.然而,DLC薄膜中存在的高残余应力,削弱了膜基结合力,导致薄膜开裂或剥落,严重限制了其使用寿命和可靠性,成为DLC薄膜研究领域中亟需解决的关键问题之一,也是基于实际应用的紧迫需求.介绍了 DLC薄膜应力产生的来源,并结合国内外研究现状从元素掺杂、过渡层和工艺调控3个方面分别综述了应力调控方面的试验和理论研究进展.结果表明,元素掺杂主要是通过降低薄膜中扭曲的C-C键长和C-C-C键角的百分比含量以及缓和键长、键角的扭曲程度来降低薄膜残余应力;添加过渡层主要通过缓解DLC薄膜与基体间因热膨胀系数不匹配而引起的内应力,从而达到降低DLC薄膜残余应力的目的;不同工艺参数对残余应力的影响较为复杂,且参数的不同组合可能会导致不同的残余应力状态.以上DLC薄膜应力来源、调控方法和机理的研究将为高质量DLC薄膜的设计和制备提供理论依据.
Research Progress in Residual Stress Modulation of Diamond-like Carbon Film
Diamond-like carbon(DLC)films are widely recognized for their outstanding properties and exhibit significant potential in various fields.Nevertheless,the presence of high residual stresses in DLC films weakens their adhesion to the substrate,thus resulting in film cracking or spalling.This limitation severely affects their durability and reliability,which is a significant challenge in DLC film research.Moreover,this issue must be addressed to enable the practical application of DLC films.In this paper,stress-generation sources in DLC films are discussed and research progress pertaining to stress modulation is summarized.In particular,elemental doping,transition layers,and process adjustments are elucidated in addition to the current global research landscape.Elemental doping is classified into single-and multi-element doping,which can be further categorized as strong and weak/non-carbide-forming elements,depending on their bonding strength with carbon atoms.The primary objective is to mitigate residual stress by reducing the proportion of distorted C-C bond lengths and C-C-C bond angles in the film,as well as moderating the extent of distortion in the bond lengths and angles.Notably,weak/non-carbide-forming elements,despite significantly reducing internal stresses,deteriorate the mechanical properties owing to their weaker bonding energies.Multi-element doping leverages the complementary properties of diverse elements,thereby reducing the stresses in DLC films significantly while maintaining robust mechanical properties and satisfying the demands of complex operating conditions more comprehensively.Metal doping primarily reduces residual stresses within the structure of DLC films.Nonetheless,owing to the dissimilar thermal-expansion coefficients between the substrate and film,high stresses can persist at the interface.Hence,a transition layer(monolayer,multilayer,gradient,etc.)is introduced between the DLC film and substrate to effectively mitigate residual stresses by alleviating internal stresses caused by mismatches in thermal-expansion coefficients.Furthermore,various deposition parameters,such as the substrate bias pressure,gas-source flux ratio,deposition temperature,deposition pressure,and carbon-source incidence angle,exert different effects on the intrinsic structure of the film.Different parameter combinations result in distinct residual-stress states.More importantly,these process parameters function synergistically,and their effects on the residual stress of the film varies under different conditions.Consequently,a comprehensive consideration of these parameters and their optimization based on specific application requirements is essential during DLC film deposition.Notably,the relationship between microstructural evolution and stress in the same elemental doping system under different preparation methods or in different elemental systems under the same preparation method varies.Hence,a refined computer-simulation technique at the atomic scale is proposed to investigate the effects of various preparation methods on the intrinsic structures of DLC films and to elucidate their stress-evolution patterns.In the future,the integration of advanced materials science and technology,such as machine learning and artificial intelligence,can be considered to further investigate DLC film preparation and stress-control challenges.

diamond-like carbon filmresidual stresselement dopingtransition layerprocess parameter

杜乃洲、付志民、冯存傲、郭鹏、李晓伟

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中国矿业大学材料与物理学院 徐州 221116

中国科学院宁波材料技术与工程研究所海洋关键材料重点实验室 宁波 315201

类金刚石薄膜 残余应力 元素掺杂 过渡层 工艺参数

2024

中国表面工程
中国机械工程学会

中国表面工程

CSTPCD北大核心
影响因子:0.652
ISSN:1007-9289
年,卷(期):2024.37(5)