The Influence of Surface State of Pure Ti on the Nucleation Mechanism of Electrolytic Copper Foil
In response to the high-quality requirements for electrodepositing copper foil on the surface of titanium cathode roller,this article mainly conducts research on the influence of grain size and surface state of pure Ti on the nucleation and growth of the initial deposition layer of electrolytic copper foil. Characterization results of morphology and composition indi-cate that a higher grain size grade is more conducive to the rapid formation of copper nuclei,which preferentially form at the defect site and gradually grow and connect into pieces;a larger roughness can cause copper nuclei to grow rapidly,and as the roughness decreases,copper nuclei will form at more positions,but their size decreases as roughness grow. Electrochem-ical analysis results indicate that the Ti sheets with appropriate roughness have higher corrosion resistance and charge transfer ability. In addition,the results of COMSOL modeling demonstrate that the tip position on the surface of Ti sheets has a high-er current density and a larger copper foil deposition thickness,and the current density and deposition thickness become smaller as the distance from the tip position on the surface of Ti sheets increases. This article provides theoreti-cal guidance for the preparation of titanium cathode roller by studying the nucleation and growth mechanism of the initial deposition layer of copper foil. Increasing the grain size grade of titanium cathode roller,appropriately reducing sur-face roughness,and avoiding the formation of tip region are crucial for the preparation of electrolytic copper foils with uniform thickness and smooth surface.
Ti cathode rollerelectrolytic copper foilgrain size graderoughnessinitial deposition layer
万方数据
维普
