首页|Analysis of Transmission Characteristics of Copper/Carbon Nanotube Composite Through-Silicon Via Interconnects
Analysis of Transmission Characteristics of Copper/Carbon Nanotube Composite Through-Silicon Via Interconnects
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We investigated the transmission characteristics of Cu/CNT composite Through-silicon via (TSV)interconnects.The equivalent lumped-element circuit model was established,with the effective conductivity employed for impedance extraction.The impacts of CNT filling ratio,temperature,and other geometrical parameters on the performance were examined.The sensitivity analysis of Cu/CNT composite TSVs was carried out.The electrical performance of Cu/CNT composite TSVs were optimized by utilizing low-permittivity dielectrics or even air-gap.
Cu/CNT compositeEquivalent circuit model Effective conductivitySensitivityElectrical performance
FU Kai、ZHENG Jie、ZHAO Wensheng、HU Yue、WANG Gaofeng
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School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China
This work is supported by the National Natural Science Foundation of China
NETL
NSTL
万方数据
维普
