首页|基于HHI指数的中国量子科技产业专利创新集聚测算研究

基于HHI指数的中国量子科技产业专利创新集聚测算研究

Research on Patent Innovation Agglomeration Calculation of China's Quantum Technology Industry Based on Herfindahl-Hirschman Index

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量子科技作为新一轮科技革命和产业变革的前沿领域,受到全社会的广泛关注.研究中国量子科技产业专利创新集聚情况,有助于支撑中国量子科技创新态势监测,为中国政企做好专利战略布局提供依据.本文引入赫芬达尔-赫希曼指数构建专利创新集聚指数模型,以量子通信、量子计算和量子传感与测量为领域分类,分别进行技术子领域、中国省市地区、战略性新兴产业量子科技专利创新集聚测算分析,借助基尼系数进一步对专利分布均衡度进行定量分析.研究表明,中国量子科技产业创新处于迅猛发展态势,创新主体百家争鸣,各子领域专利创新分散竞争趋势明显,但各子领域区域创新集聚程度明显不同.中国战略性新兴产业量子科技专利结构分类呈多样性,在大多产业中的创新稍显不足.
As a cutting-edge field in the new round of technological revolution and industrial transformation,quantum technology has received great attention.The research on the patent innovation agglomeration of quantum technology industry in China is helpful to support the monitoring of quantum technology innovation situation and provides a basis for the Chinese government to make a good patent strategic layout.The Herfindahl-Hirschman Index(HHI)is introduced to build a patent innovation agglomeration index model,quantum communication,quantum computing,and quantum sensing and measurement are classified as fields,and quantum technology patent innovation agglomerations are calculated and analyzed respectively in technology sub-fields,Chinese provinces and cities,and strategic emerging industries.Further quantitative analysis of patent distribution equilibrium is conducted through the Gini coefficient.The research shows that quantum technology industry innovation of China is developing rapidly,innovative entities are emerging,the trend of decentralized competition in patent innovation in various sub fields is evident,but the degree of regional innovation agglomeration in each sub field is significantly different.The classification of quantum technology patent structures in strategic emerging industries shows diversity,with slightly insufficient innovation in most industries.

quantum technologyinnovation agglomerationHHIpatent layoutdata analysis

刘宝琪、张成鲁、薛非

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军事科学院军事科学信息研究中心,北京 100142

量子科技 创新集聚 HHI指数 专利布局 数据分析

军事科学院2023年智强基金

2024

中国发明与专利
知识产权出版社,中国发明协会

中国发明与专利

CSTPCD
影响因子:0.15
ISSN:1672-6081
年,卷(期):2024.21(3)
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