首页|生物基半芳香族共聚酰胺PA5T/56与脂肪族聚酰胺PA56的性能对比

生物基半芳香族共聚酰胺PA5T/56与脂肪族聚酰胺PA56的性能对比

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生物基聚酰胺PA56 凭借其绿色低碳的原料来源以及与商业化 PA66 相近的综合性能而受到关注,但受限于脂肪族的柔性主链结构,无法满足高温场景下的使用需求.为解决上述问题,引入对苯二甲酸构筑生物基半芳香族共聚酰胺PA5 T/56,对 PA5T/56 的结构及性能进行系统研究,并与生物基脂肪族聚酰胺 PA56 进行对比分析.红外光谱与核磁共振氢谱的表征结果验证了PA5T/56 与PA56 结构上的差异;相比PA56,PA5 T/56 具有更高的玻璃化转变温度(tg=113℃)、更优的热稳定性(td,5%=392℃,tdmax=423℃),以及更佳的热机械性能,同时其在高温下具有适宜加工的熔体黏度(<103 Pa·s),这些优势赋予生物基半芳香族PA5T/56 广阔的应用前景.
Performance comparison of bio-based semi-aromatic copolyamide PA5T/56 and aliphatic polyamide PA56
Bio-based PA56 has obtained much more attention thanks to its environmentally friendly raw material sources and comparable overall properties to commercial PA66.However,its usability in high-temperature scenarios is limited by the aliphatic nature of its monomeric structure.Therefore,the PA5 T/56 incorporating terephthalic acid monomers was investigated to broaden its range of applications.This study focuses on the characterization of the bio-based semi-aromatic PA5 T/56,which was synthesized by terephthalic acid monomer.A comparison was made between the structure and properties of PA5 T/56 and bio-based aliphatic PA56.FTIR and NMR results confirm the structural differences of bio-based PA5 T/56.In comparison to bio-based aliphatic PA56,bio-based semi-aromatic PA5 T/56 exhibits a higher glass transition temperature(tg=113℃),exceptional thermal stability(td,5%=392℃,tdmax=423℃),as well as superior thermomechanical properties and melt viscosity suitable for processing(<103 Pa·s).Therefore,PA5 T/56 is endowed with broaden application scenarios by virtue of its excellent performance.

bio-based polyamidesemi-aromatic polyamidealiphatic polyamidemelt crystallization behaviorthermal stabilitythermomechanical propertyrheological behavior

张海洋、郭小炜、宋云鹤、田卫东、管清宝、游正伟

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东华大学 材料科学与工程学院,上海

东华大学 纤维材料改性国家重点实验室,上海

黑龙江伊品新材料有限公司,黑龙江 大庆

成都升宏新材料科技有限公司,四川 成都

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生物基聚酰胺 半芳香族聚酰胺 脂肪族聚酰胺 熔融结晶行为 热稳定性 热机械性能 流变行为

国家重点研发计划中央高校基本科研业务费专项

2021YFC2101800CUSF-DH-T-2023034

2024

东华大学学报(自然科学版)
东华大学

东华大学学报(自然科学版)

CSTPCD北大核心
影响因子:0.308
ISSN:1671-0444
年,卷(期):2024.50(3)
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