首页|Dual-Material Electron Beam Selective Melting: Hardware Development and Validation Studies

Dual-Material Electron Beam Selective Melting: Hardware Development and Validation Studies

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Electron beam selective melting (EBSM) is an additive manufacturing technique that directly fabricates three-dimensional parts in a layerwise fashion by using an electron beam to scan and melt metal powder.In recent years, EBSM has been successfully used in the additive manufacturing of a variety of materials.Previous research focused on the EBSM process of a single material.In this study, a novel EBSM process capable of building a gradient structure with dual metal materials was developed, and a powder-supplying method based on vibration was put forward.Two different powders can be supplied individually and then mixed.Two materials were used in this study: Ti6AI4V powder and Ti47Al2Cr2Nb powder.Ti6AI4V has excellent strength and plasticity at room temperature, while Ti47AI2Cr2Nb has excellent performance at high temperature, but is very brittle.A Ti6AI4V/Ti47AI2Cr2Nb gradient material was successfully fabricated by the developed system.The microstructures and chemical compositions were characterized by optical microscopy, scanning microscopy, and electron microprobe analysis.Results showed that the interface thickness was about 300 μm.The interface was free of cracks, and the chemical compositions exhibited a staimase-like change within the interface.

additive manufacturingelectron beamselective meltinggradient materialstitanium alloyTiAl alloy

Chao Guo、Wenjun Ge、Feng Lin

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Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

Key Laboratory for Advanced Materials Processing Technology (Ministry of Education of China), Tsinghua University, Beijing 100084, China

Biomanufacturing and Rapid Forming Technology Key Laboratory of Beijing, Tsinghua University,Beijing 100084, China

authors would like to acknowledge the funding of 2013 Beijing Science and Technology Development Projectauthors would like to acknowledge the funding of 2013 Beijing Science and Technology Development Project

D13110400300000D131100003013002

2015

10.15302/J-ENG-2015013

工程科学(英文版)
中国工程院出版委员会

工程科学(英文版)

影响因子：0.226
ISSN：1672-4178
年,卷(期)：2015.1(1)
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