To improve the full-temperature performance of the micro-electro-mechanical system(MEMS)accelerometer,the stress cancellation of the anchor zone,low stress bonding technology and temperature compensation method are proposed.Firstly,the stress cancellation in the anchor zone is realized by adjusting the size of the anchor area of the two bonds,and the temperature performance of the accelerometer is improved.Then,the accelerometer stacking packaging model is established and the bonding parameters of application specific integrated circuit(ASIC),the dispensing methods and the dispensing parameters of accelerometer sensitive structure are simulated,so as to determine the low-stress bonding form and bonding process of the accelerometer.Finally,a three-order temperature compensation method is designed to compensate for zero bias and scale factor of accelerometer and tested experimentally.The experimental results show that the accelerometer zero bias stability over temperature reached 47.3 μg(1σ)and scale factor stability over temperature reached 43.6 ppm(1σ),which improves the full-temperature performance of the accelerometer.
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