Micro-channel Cooling Technology for Three-dimensional Integration
With the development of modern three-dimensional integration technology,electronic components with high density,integration and miniaturization are required,and the high internal heat flux becomes a decisive factor affecting the long term reliability of devices.Under this development trend,the thermal management becomes more and more important,whose importance is no less than the chip design itself.Micro-channel cooling technology takes the advantage of excellent thermal dissipation,making it the first choice for thermal management for high-density integrated devices,and attaches worldwide attention.After decades of research,the micro-channel technology has evolved several different routes,and more than ten kinds of micro-channel design schemes with different structures has appeared.To get better understanding of this rapidly changing technology,systematic research and reviews are necessary.
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