片间光电融合技术分析
The summary of inter-chip optoelectronic integration
孙佳琪 1宋艳飞 1王睿哲1
作者信息
摘要
本文概述了片间光电融合技术发展现状及趋势.在5G、人工智能等应用场景驱动下,片间光互联成为实现芯片之间信息交互的重要方式之一.其中,硅基光电子技术和光电共封装技术发挥了重要作用.本文回顾了光电共封装技术以及激光器、硅基光电探测器和硅基电光调制器发展现状和面临挑战,并结合硅基光电子产业情况提出相关建议,以期为推动我国集成电路产业向高质量发展提供参考和借鉴.
Abstract
This article summerize the development of the inter-chip optoelectronic integration techology.On the urgent demand of the application scenarios of 5G and AI,optical interconnection is utilzed in interchips,which is strongly based on silicon photonics and co-packaged optics.Here,we reviews the techology of co-packed optics,laser,photondetector and silicon modulator.At last,according to the industry status,relevant suggestions are proposed for promoting the high-quality development of China's integrated circuit industry.
关键词
硅基光电子/光电共封装/激光器/硅基光电探测器/硅基电光调制器Key words
silicon photonics/co-packed optics/laser/photondetector/silicon modulator引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据