One Solution for High Reliable IP Design and Research
This article probes and studies the physical mechanism of EM(Electromigration)between metal layers of one finished IC(Integrated Circuits)when it has been power-on for some time.Which could be one of the causes to impact high reliability design of an IP circuit,and it belongs to one kind of"hard error"indeed.In addition,it also studies the MTTF formula applicable to this phenomenon while analysis of experimental data is provided to illustrate its effect as IC manufacturing process evolves.On the other hand,it also probes the impact of noise to high reliable IP design as a kind of"soft error",furthermore,it also proposes a kind of high voltage(HV)design solution to improve high reliability of IP design,which also has the benefit to reduce leakage current.
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