The study focused on testing the packaging technology of large-size chips using flip chip bonding,specifi-cally examining the flip-chip,reflow soldering,underfill application,and 4000 pin-level ball planting process.The results show that the process capability can well cover the plastic package of the 4000 pin FCBGA circuit.The relia-bility test results show that the 4000 pin FCBGA plastic packaging circuit can be stored at high temperature(150℃)for 1000 hours,the temperature cycle life(-65℃～150℃)can reach 500 times or more,the time of highly accelerat-ed stress test(130℃/85％)can reach 96 hours.After the environmental test,the circuit open/short test passed.
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