基于倒装焊的大尺寸芯片塑封工艺研究
Research on Plastic Packaging Technology for Large-Size Chips Based on Flip-chip Bonding
吉勇 1杨昆 1陈鹏 2张永胜 2李杨1
作者信息
- 1. 无锡中微高科电子有限公司;中国电子科技集团公司第五十八研究所
- 2. 无锡中微高科电子有限公司
- 折叠
摘要
基于倒装焊的大尺寸芯片塑封工艺,研究了 4000pin级电路封装工艺试验,对大尺寸芯片倒装、回流焊接、底填以及4000 pin级植球等关键工艺步骤进行了研究和评估.工艺试验结果表明工艺能力可以较好地覆盖4000 pin级倒装芯片球栅格阵列(FCBGA)电路塑料封装.可靠性测试结果表明,4000 pin级FCBGA塑料封装电路高温贮存(150℃)可达1000 h,温循寿命(-65℃～150℃)可达500次,强加速稳态湿热试验(130℃/85％)可达96 h,且环境试验后的电路通断测试正常.
Abstract
The study focused on testing the packaging technology of large-size chips using flip chip bonding,specifi-cally examining the flip-chip,reflow soldering,underfill application,and 4000 pin-level ball planting process.The results show that the process capability can well cover the plastic package of the 4000 pin FCBGA circuit.The relia-bility test results show that the 4000 pin FCBGA plastic packaging circuit can be stored at high temperature(150℃)for 1000 hours,the temperature cycle life(-65℃～150℃)can reach 500 times or more,the time of highly accelerat-ed stress test(130℃/85％)can reach 96 hours.After the environmental test,the circuit open/short test passed.
关键词
大尺寸芯片封装/4000/pin/高可靠塑封Key words
large-size chip packaging/4000 pin/high reliability plastic packaging引用本文复制引用
出版年
2024
NETL
NSTL
万方数据