摘要
2023年专用集成电路(ASIC)的市场规模和比重均达历史新高,持续增长的动力强劲.本文面向专用集成电路需求,从销售额、比重、细分应用领域发展分化等方面分析了 ASIC的市场规模与分布,从终端需求、能源约束、供应链和价格等方面总结了 ASIC兴起的主要驱动力.同时,提出ASIC发展的几个趋势:新一轮半导体上行周期将推动ASIC比重首次过半,领域专用架构、开源处理器指令集架构、芯粒成为半导体产业成长的主要技术驱动力,半导体产品"通久必专"推动产业模式"分久必合".
Abstract
In 2023,the market size and proportion of Application Specific Integrated Circuits(ASICs)reached historic highs,with strong momentum for sustained growth.Focusing on the demand for ASICs,this paper analyzes the market size and distribution of ASICs from the aspects of revenue,proportion,and development differentiation in segmented application fields.The main driving forces for the rise of ASICs are summarized from the aspects of termi-nal demand,energy constraints,supply chain,and prices.Several trends in the development of ASICs are proposed:the new round of semiconductor upward cycle will drive the proportion of ASICs to exceed half for the first time,with Domain Specific Architectures,open source processor Instruction Set Architectures,and Chiplet becoming the main technological driving forces for the growth of the semiconductor industry.The"long-term General Purpose ends in Application Specific"of semiconductor products will drive the"long-term division ends in integration"of the industry model.
NETL
NSTL
万方数据