Failure Analysis and Improvement of UFS Products Circuit Break
Universal Flash Storage(UFS)products are characterized by high performance,large capacity,low power consumption,reliability,and compatibility.Therefore,the interconnection requirements of each layer inside the UFS products are very high,and open-circuit problems are very likely to occur in the production process.This paper focuses on the in-depth study of the entire structure of UFS and open-circuit anomalies,analyzes the main factors affecting the occurrence of cracks on the substrate inside the products,and improves the anomalies of open-circuit of the products caused by cracks on the substrate through DOE testing,and finally,provides directions and suggestions for the reliability and safety of the subsequent production of UFS products based on the test results.
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