Hermetic packaging technology is widely utilized in the realm of high-reliability electronic component packaging.The primary bonding material used is Au80Sn20 alloy to seal the cover plate and package body.However,the shrinkage of the tungsten metal layer on the ceramic package body during curing results in a concave shape of the metallization area of the solder ring,with the middle being lower and the sides being higher.Traditional sealing cover plates have flat solder,and insufficient solder flowability during welding can lead to air pockets in the weld that cannot be expelled,resulting in voids in the welding area.In this paper,an Au78Sn22 alloy solder sheet is first placed on a gold-plated cover plate and pre-melted at 305℃ under vacuum conditions.The Au78Sn22 alloy solder sheet forms a convex arc shape after melting and firmly bonds to the surface of the cover plate upon cooling.The pre-melted cover plate is then placed on the sealing area of the ceramic package body,and the alloy sealing process is conducted using a reflow oven.The solder,after melting,forms an arc shape that better conforms to the sealing surface of the package body,facilitating the expulsion of air pockets in the weld during the alloy sealing process,thereby reducing porosity and enhancing the strength and reliability of the seal.Devices prepared using the method described in this paper exhibit almost no voids on the sealing surface,satisfying the quality requirements of alloy sealing.This method con-tributes to the improvement of component packaging quality and holds certain guiding significance within the industry.
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