This study aims to address the high-precision challenge of teardrop formation in the field of integrated circuit packaging design.Based on the in-depth analysis of the limitations of teardrop technology in the field of print-ed circuit hoard production during the packaging process of integrated circuit chips,a new method for improving the accuracy of teardrop formation is proposed in this paper.The technology has achieved important progress in the fields of droplet characteristics configuration,preliminary processing,core program decision,criterion control and so on,and achieved micro-scale accuracy of droplet structure.This study demonstrates originality in the technical level and shows high efficiency and good stability in practical operation,and has broad commercial growth space.
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