In the process of promoting digital transformation and building CIM systems in semiconductor manufactur-ing enterprises,breaking down data silos between various digital business systems and between digital systems and workshop equipment,and achieving data interconnection,interoperability,and integration is a common challenge faced by all enterprises.This article introduces the third-generation semiconductor CIM system and the functional division of each subsystem,with a focus on the integration solutions between the three core subsystems MES,SPC,EAP,and between EAP and equipment monitoring systems.This solution has been successfully applied in a wafer manufacturing workshop of a certain company,providing reference for CIM system planning,design and development,implementation and application in semiconductor manufacturing factories.
万方数据
维普
