首页|车规级芯片信息安全温度干扰测试模型研究

车规级芯片信息安全温度干扰测试模型研究

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随着新能源汽车电动化、网联化、智能化的发展,车规芯片的信息安全问题越来越重要.其中温度影响是芯片信息安全不可忽视的因素,然而此领域目前还没有成熟的评价方法,本文探索性地分析了温度对芯片的干扰机理,对电气性能、安全性能的影响,结合实际需求,选择关联影响参数,设计了一种有效的安全芯片温度度量测试模型.测试结果表明,该测试模型能够反映温度对芯片信息安全的影响,直观体现车规芯片与非车规芯片性能差异.
Temperature Interference Measurement Model of Automotive Security Chip
With the development of electrification,networking,and intelligence in new energy automobile,the issues of information security for automotive chip is becoming increasingly important.Temperature is the factor that cannot be ignored in its impact on secure chips without a proper evaluation method.This paper analyzes exploratively the temperature interference mechanism of chips,its effects on electrical and security performance,selects related influ-encing parameters with consideration of practical requirements.A temperature measurement test model for secure chips has been designed.The results demonstrate that it can reflect the influence of temperature on information secu-rity of chips and intuitively highlight the performance differences between automotive and non-automotive chips.

automotive chipsinformation securitytemperature interferencetest model

徐宏坤、杜新、杨利华、潘亮

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北京中电华大电子设计有限责任公司,射频识别芯片检测技术北京市重点实验室

车规芯片 信息安全 温度影响 测试模型

2024

中国集成电路
中国半导体行业协会

中国集成电路

影响因子:0.144
ISSN:1681-5289
年,卷(期):2024.33(11)