Progress in High Bandwidth Memory(HBM)Manufacturing Technologies and Future Developments
With the rapid advancement of intelligent data applications,the bottleneck in computational power caused by memory bandwidth limitations is becoming increasingly evident.This bottleneck is becoming progressively more challenging to address in the face of the escalating market demands for high-performance computing and data processing capabilities.Against this backdrop,High Bandwidth Memory(HBM)is seen as one of the key solutions to breaking through the computational power bottleneck and has become a hot topic in the field of advanced packaging technology research and development.This article will review the development history of HBM manufacturing processes,analyze its technical advantages,and provide an outlook on its future development direction.
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