首页|离子交换法对建筑陶瓷力学性能的影响及强化机理研究

离子交换法对建筑陶瓷力学性能的影响及强化机理研究

扫码查看
建筑陶瓷板的强度对于提高装饰材料寿命和节能环保有重大意义.离子交换法能通过有效增强陶瓷表层的面向挤压应力来提高陶瓷的断裂阻力和抗弯强度.影响陶瓷强化工艺的两个关键因素是离子交换温度和离子交换时间.本文采用KNO3熔盐对建筑陶瓷板作离子交换强化处理,分析离子交换温度和离子交换时间对陶瓷样品力学性能的影响,并进一步探讨强化机理.结果表明,离子强化处理后陶瓷的抗弯强度、断裂韧性和表面硬度得到大幅提升,同时弹性模量和质量密度几乎不变.离子交换法通过KNO3熔盐的K+与陶瓷表面的Na+之间的置换反应在陶瓷表层形成预压应力抵消了部分破坏载荷.试验得出,在600℃下处理20h,样品的抗弯强度达到最大值216.10MPa,相比原始样品提升103.20%.
Effects and strengthening mechanism of ion exchange treatment on mechanical properties of building ceramics
The strength of building ceramic tiles is of great significance in improving the service life of decorative materials and energy conservation and environmental protection.Ion exchange treatment can effectively improve the fracture resistance and flexural strength of ceramics by enhancing the surface extrusion stress.The two key factors affecting the ceramic strengthening process are ion-exchange temperature and ion-exchange time.In this paper,KNO3 molten salt is used to strengthen the mechanical properties of building ceramic plates.The effects of ion-exchange temperature and ion-exchange time on the mechanical properties of ceramics are analyzed,and the strengthening mechanism is further discussed.The results show that the flexural strength,fracture toughness and surface hardness are greatly improved after ion exchange treatment,while the elastic modulus and mass density are almost unchanged.By ion exchange treatment,preload compressive stress is formed on the ceramic surface through the displacement reaction between K+ of KNO3 molten salt and Na+ of the ceramic surface to offset part of the destructive loads.Under the ion exchange process at 600℃for 20h,the flexural strength of the ceramic sample reaches the maximum of 216.10MPa,which is 103.20%higher than that of the original sample.

building ceramicsion exchangechemical temperingcompressive stress layerstrengthening mechanism

李俊峰、包亦望

展开 >

中国建筑材料科学研究总院有限公司 绿色建筑材料国家重点实验室,北京 100024

建筑陶瓷 离子交换 化学钢化 压应力层 强化机理

国家自然基金重点项目

52032011

2024

中国建材科技
中国建筑材料科学研究总院

中国建材科技

影响因子:2.418
ISSN:1003-8965
年,卷(期):2024.33(2)
  • 24