首页|Slicing of large-size single crystals by ultrafast laser with external stress assistance
Slicing of large-size single crystals by ultrafast laser with external stress assistance
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The existing single-crystal slicing techniques result in significant material wastage and elevate the production cost of premium-quality thin slices of crystals.Here we report(for the first time,to our knowledge)an approach for vertical slicing of large-size single-crystal gain materials by ultrafast laser.By employing aberration correction techniques,the optimi-zation of the optical field distribution within the high-refractive-index crystal enables the achievement of a continuous laser-modified layer with a thickness of less than 10 μm,oriented perpendicular to the direction of the laser direction.The compressed focal spot facilitates crack initiation,enabling propagation under external forces,ultimately achieving the successful slicing of a Φ12 mm crystal.The surface roughness of the sliced Yb:YAG is less than 2.5 μm.The results illustrate the potential of low-loss slicing strategy for single-crystal fabrication and pave the way for the future develop-ment of thin disk lasers.
single-crystal gain materialsultrafast laserslicingYAGaberration correction
王力锋、刘莉莉、王逸男、李珣、李晨晨、李明
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State Key Laboratory of Transient Optics and Photonics,Xi'an Institute of Optics and Precision Mechanics,Chinese Academy of Sciences,Xi'an 710119,China
University of Chinese Academy of Sciences,Beijing 100049,China
National Key Research and Development Program of ChinaNational Key Research and Development Program of China
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