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集成透镜的多波段红外探测器组件封装技术

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多光谱探测器的小型化和集成化已成为红外探测器的发展方向之一.针对多波段探测器集成低温光学透镜的特点,提出了一种集成透镜兼窗口的气密性封装组件结构.对同一组件多波段探测器不同焦面高精度光学配准、低形变滤光片支撑结构及防光学串扰、杂散光抑制等方面进行了研究.以某项目用短波红外组件为研究对象,通过3个10元探测器拼接后与3个波段滤光片和透镜低温配准、低形变多波段滤光片窄缝拼接结构设计、杂散光分析抑制等关键技术,实现了 3波段探测器与滤光片拼接精度优于±5μm,透镜与探测器配准精度优于±15μm,滤光片低温形变小于0.9278μm,多波段间无明显光学串扰,并经受住1500 h长时间通电老练以及总均方根加速度为22.0 g的随机振动和60g的冲击加速度试验考核.解决了多波段探测器小型化和集成化封装中的高精度配准、低形变滤光片支撑、防光学串扰、杂散光抑制等一系列问题.该组件已成功应用于某项目用光谱成像仪中.
Research on Packaging Technology of Multi-Band Infrared Detector Assembly with Integrated Lens
Objective The miniaturization and integration of multispectral detectors have become one of the development directions for infrared detectors.This paper proposes a component structure that integrates a lens and window with airtight packaging,focusing on the characteristics of integrating low-temperature optical lenses for multispectral detectors.Various aspects are investigated,including high-precision optical alignment for different focal planes of the same component multispectral detector,low deformation filter support structure,and suppression of optical crosstalk and stray light.These studies address a series of issues related to high-precision alignment,low deformation filter support,prevention of optical crosstalk,and suppression of stray light in the miniaturization and integration packaging of multispectral detectors.The developed component has been successfully applied in a spectral imaging instrument for a specific project.Methods A component structure for a multispectral infrared detector with an integrated lens has been designed(Fig.3).The airtight packaging component structure of the multispectral infrared detector with an integrated lens includes a component housing,coverplate,lens,primary aperture,filter holder,filter,chip module,electrode plate,and filter holder support.Before packaging,the entire component is evacuated,followed by filling with inert gas,and finally sealed using parallel seam welding.The airtightness meets the long-term requirements of the payload.By designing a three-layer laminated low-deformation multispectral filter holder assembly,multiple small filter pieces are adhered to the low-stress filter holder structure.This structure can also be used for the assembly of multiple mid-wave and long-wave filter pieces with the detector.It overcomes the problems of size interference and complex integration process with low yield associated with traditional bonding methods.It achieves the coupling of low-deformation multispectral filters with the detector(Fig.4).This study employs the micro-adjustment technique for different focal planes of the multispectral infrared detector and the coaxial lens adjustment technique.It achieves a precision deviation of less than±5 μm between different focal planes and the filter assembly for a three-band detector within the same component.The lens-to-detector alignment precision within±15 μm is achieved(Table 1).Spectral tests are performed using the infrared detector component with an integrated lens,and the results indicate no significant optical crosstalk among channels(Fig.6).Results and Discussions Through the design of a three-layer laminated structure with low deformation,multiple small filters have been successfully bonded to the low deformation stress filter frame.The maximum low-temperature deformation of the 1.64 μm filter at 130 K is 0.9278 μm,while the maximum low-temperature deformation of the 2.13 μm and 1.38 μm filters at 130 K is 0.2292μm(Fig.5).By using micro-adjustment techniques for different focal planes of the multi-band infrared detectors and coaxial lens adjustment techniques,the deviation in the alignment between different focal planes of the three-band detectors and the filters within the same component is better than±5 μm,and the alignment precision between the lens and the detectors is better than±15 μm.Spectral testing is conducted using the integrated lens infrared detector component.The results of the spectral testing indicate that there is no significant optical crosstalk among channels.A series of low-stress design and process improvements are applied to the low-temperature lens,and the results show that the band detection rate is greater than 1.5×1011 cm·Hz1/2·W-1(130 K).The maximum absolute variation in band response rate before and after rigorous environmental testing is 8.5%(Fig.9).The high-performance multi-spectral integrated infrared detector component is obtained,and the experimental results confirm that the detector functions properly and the component performs well(Table 2).Conclusions This article focuses on solving the packaging technology of multi-channel integrated infrared detector components,proposes a multi-band infrared detector airtightness packaging component with integrated lenses,and emphasizes the key technologies such as jointing of different focal planes for different bands and coaxial lens adjustment technology for the same component,high reliability support structure for multi-filter narrow seam splicing,and stray light suppression,solving the high-precision alignment of multi-channel integrated infrared detector components,low stress control,low optical crosstalk,low power consumption,and high reliability of the detector.A high-performance multi-band infrared detector component with integrated lenses has been obtained.

detectorsmulti-channel integration technologyinfrared detector assemblylow-temperature deformation of filteroptical crosstalk

陈俊林、莫德锋、蒋梦蝶、朱海勇、徐勤飞、曾智江、张晶琳、杨晓阳、李雪

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中国科学院上海技术物理研究所传感技术国家重点实验室,上海 200083

中国科学院上海技术物理研究所,上海 200083

探测器 多通道集成技术 红外探测器组件 滤光片低温形变 光学串扰

2024

中国激光
中国光学学会 中科院上海光机所

中国激光

CSTPCD北大核心
影响因子:2.204
ISSN:0258-7025
年,卷(期):2024.51(13)