微流控芯片流体动压抛光工艺研究
Research on Microfluidic Chip Fluid Dynamic Pressure Polishing Process
付振峰 1王振忠 1王彪1
作者信息
- 1. 厦门大学航空航天学院,厦门,361005
- 折叠
摘要
基于流体动压润滑理论设计了微结构抛光球,理论分析得出微结构在抛光球转动过程中会产生更大的流体动压力;利用 Fluent 分析了微结构类型、微结构尺寸对抛光产生的动压力的影响,通过MATLAB拟合Fluent的数据得到其产生的抛光力.得到微结构的较优参数后进行微流控芯片的区域抛光,微流控芯片平面区域表面粗糙度从 1.330 nm 降至 0.658 nm,流道表面粗糙度从 0.737 nm 降至0.379 nm.由此可进一步探索流体动压抛光技术在微流控芯片确定性抛光中的应用.
Abstract
Microstructure polishing ball was designed based on fluid dynamic pressure lubrication theory,through theoretical analysis of the microstructure in the polishing ball rotation processes to generate more fluid dynamic pressure.Fluent was used to analyze the type of microstructure and the effects of microstructure size on the dynamic pressure generated by polishing,the generated polishing force was obtained by fitting Fluent's data via MATLAB.After obtaining the better parameters of mi-crostructure,area polishing of the microfluidic chips was performed.The surface roughness of the mi-crofluidic chip plane area is reduced from 1.330 nm to 0.658 nm,and the surface roughness of the mi-crofluidic chip flow channel is reduced from 0.737 nm to 0.379 nm.Thus,the applications of hydrody-namic pressure polishing process to the deterministic polishing of microfluidic chips may be further explored.
关键词
动压润滑理论/Fluent求解/超精密抛光/微流控芯片Key words
dynamic pressure lubrication theory/Fluent solution/ultra-precision polishing/mi-crofluidic chip引用本文复制引用
出版年
2024
国家科技期刊平台
NSTL
万方数据