Interface Quality Detection of Double-layer Bonding Structures Based on Ultrasonic Guided Wave Technology
A ultrasonic guided wave detection method was proposed to address the difficulty in de-tecting the interface quality of adhesive structures.Based on the spring model and wave equation,the mathematical model of ultrasonic guided wave propagation in the double-layer bonding structure was established,and the dispersion equations of different bonding interfaces were obtained.The dispersion characteristics of different bonding interfaces were obtained by solving the equations.The propagation processes of sound waves at different adhesive interfaces were simulated using COMSOL software.The simulation results show that under the condition of 1 MHz frequency rigid bonding,the group velocity numerically solved is as 4.632 km/s,and the simulated mean group velocity is as 4.505 km/s,with er-ror of 2.74％.Under the condition of slip bonding,the numerical solution group velocity is as 4.855 km/s,and the simulation mean group velocity is as 5.045 km/s,with error of 3.91％.Under the condition of complete debonding,the dispersion curve of the double-layer adhesive structure is the superposition of the single-layer dispersion curve.Through the analysis of the experimental detection results of ultrasonic guided waves in double-layer media,it is found that the experimental results are in good agreement with the numerical solution and finite element simulation ones,which verifies the correctness of the theoretical model.
bonded structurespring modeldispersion equationfinite element simulationgroup velocity
万方数据
维普
