In order to effectively improve the quality of GaAs-based semiconductor laser cavity mirrors,a new type of scribing method was proposed and carried out in simulation analysis and pro-cessing experiments.A finite element simulation model of the scribing processes of GaAs materials was established to optimize the existing processing methods and to investigate the distribution of scri-bing loads and stresses under different processes.A cleavage processing validation experiment was car-ried out to analyze the morphological characteristics of the cleavage surfaces.It is found that the opti-mized processing method,which involves scribing from the inside out,can effectively reduce the de-gree of material surface damages in the scribing processes and reduce the brittle fracture phenomenon.The experimental results were in high consistency with the simulation ones.
关键词
半导体激光器/谐振腔面/砷化镓解理加工/有限元分析
Key words
semiconductor laser/resonant cavity surface/GaAs cleavage processing/finite element analysis
维普
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