Simulation Analysis and Process Study of Scribing Processes for GaAs Cleavage Processing
In order to effectively improve the quality of GaAs-based semiconductor laser cavity mirrors,a new type of scribing method was proposed and carried out in simulation analysis and pro-cessing experiments.A finite element simulation model of the scribing processes of GaAs materials was established to optimize the existing processing methods and to investigate the distribution of scri-bing loads and stresses under different processes.A cleavage processing validation experiment was car-ried out to analyze the morphological characteristics of the cleavage surfaces.It is found that the opti-mized processing method,which involves scribing from the inside out,can effectively reduce the de-gree of material surface damages in the scribing processes and reduce the brittle fracture phenomenon.The experimental results were in high consistency with the simulation ones.
semiconductor laserresonant cavity surfaceGaAs cleavage processingfinite element analysis
万方数据
维普
