Vat Photopolymerization versus Conventional Colloidal Processing Methods in Structural Ceramics:Progress,Challenges,and Future Perspectives

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外文摘要：Additive manufacturing(AM)has become a versatile and diverse technology that has a significant impact on manufacturing processes.Therefore,ceramic materials have been developed rapidly for use in AM processes.Vat photopolymerization(VPP)is an AM method that enables the production of dense ceramic components with increased dimensional accuracy.In particular,it facilitates the fabrication of small and intricately shaped parts.This review summarizes the research advancements in ceramics prepared via VPP.Special attention is paid to the current status of relevant areas,such as slurry preparation and process optimization,as well as the form-ing mechanisms,debinding,sintering,performance characterization,and use of VPP-based ceramics.Moreover,earlier studies performed by our research group on numerous VPP-based ceramic aspects are considered.In ad-dition,a concise overview of the differences in forming principles,mechanical performance,advantages,and disadvantages between VPP-based ceramics and conventional colloidal-forming ceramics is presented.Finally,the challenges and prospects of VPP-based ceramics are discussed.

外文关键词：

Vat photopolymerizationConventional colloidal formingStructural ceramicSlurryDebinding and sinteringMechanical properties

作者：

Yehua Li、Pengfei Sheng、Lifu Lin、Liang Wang、Donglin Lu、Kunji Lin、Haidong Wu、Shanghua Wu

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作者单位：

School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou,510006,China

基金：

Key-Area Research and Development Program of Guangdong Province of ChinaGuangdong Basic and Applied Basic Research Foundation of ChinaLocal Innovative and Research Teams Project of Guangdong Pearl River Talents Program of ChinaFoshan Science and Technology Innovation Team Project of China

项目编号：

2020B0909230022019B15151300052017BT01C169FS0AA-KJ919-4402-0023

出版年：

2024

DOI：

10.1016/j.amf.2024.200110

中国机械工程学报:增材制造前沿(英文)

ISSN：

年,卷(期)：2024.3(1)