In recent years,the TP problem of small and medium-sized product clients has occurred frequently.One type of TP defect is caused by the abnormally large FOG Bonding resistance,but the secondary cause is unknown.As we all know,the FOG stack structure is PNL+ACF(anisotropic conductive adhesive)+FPC,but PNL and FPC are routing resistances,and their own resistances are small(＜1 Ω),so the influence here is not considered.This paper focuses on the FOG bonding contact resistance.We first establish a mechanism model to explore,and then adjust the FOG Bonding parameters to optimize the explosion state of ACF conductive particles and the curing state of the colloid,and finally reduce the resistance.
FOG Bondingcontact resistanceACF blastingACF curing
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