At present,some integrated circuit packaging companies use traditional testing techniques to detect quality issues in packaging circuits,such as high human resource costs.With the continuous development of 3C technology,attempts are being made to use image processing to detect product quality and improve detection quality and level.Based on this,this article mainly introduces the process of using image processing technology to detect and analyze the quality of integrated circuit packaging,including the application of image subtraction and image intensity value method in the detection and analysis of integrated circuit packaging quality,in order to provide useful references for relevant personnel.
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