首页|Convective drying of wood chips:Accelerating coupled DEM-CFD simulations with parametrized reduced single particle models

Convective drying of wood chips:Accelerating coupled DEM-CFD simulations with parametrized reduced single particle models

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The simulation of industry-scale reactive bulks is challenging due to the complex interaction between fluid and particles.The particles in the bulk and their interaction with the fluid flow can be described by combined Discrete Element Method-Computational Fluid Dynamics(DEM-CFD)models.However,the computational cost of the Finite Volume(FV)methods deployed in these models can become prohibi-tively expensive,especially for high inner-particle resolution.Single particle Reduced Models(RMs)can be used to achieve both fast and accurate descriptions of the processes in each particle.As an example of bulk systems comprising heat and mass transfer,we compared FV and RM simulations for the drying of wood chips in a bulk reactor.A manifold-based nonlinear interpolation was applied to resolve changing boundary conditions for the RM.Our simulations showed that RMs provide accurate values for the thermodynamic state variables of the particles.Furthermore,the time required for the bulk simulation was reduced by 67%with the RMs.It is evident that simulations with high inner-particle resolution can be accelerated by RMs if manifold-based nonlinear interpolation is used to address changing boundary conditions.

Reduced modelReactive bulkDiscrete element methodManifold-based interpolationDrying of porous mediaDEM-CFD

Lucas Reineking、Jonas Fischer、Ali Mjalled、Enric Illana、Siegmar Wirtz、Viktor Scherer、Martin M?nnigmann

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Automatic Control and System Theory,Ruhr-Universität-Bochum,Universitätstraße 150,Bochum,44801,Germany

Energy Plant Technology,Ruhr-Universität-Bochum,Universitätstraße 150,Bochum,44801,Germany

Deutsche Forschungsgemeinschaft(DFG,German Research Foundation)Gef?rdert durch die Deutsche Forschungsgemeinschaft(DFG)

422037413-TRR 287422037413-TRR 287

2024

颗粒学报(英文版)
中国颗粒学会 中国科学院过程工程研究所

颗粒学报(英文版)

CSTPCD
影响因子:0.632
ISSN:1674-2001
年,卷(期):2024.84(1)
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