首页|Three-dimensional numerical manifold method for heat conduction problems with a simplex integral on the boundary

Three-dimensional numerical manifold method for heat conduction problems with a simplex integral on the boundary

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The three-dimensional numerical manifold method(3D-NMM),which is based on the derivation of Galerkin's variation,is a powerful calculation tool that uses two cover systems.The 3D-NMM can be used to handle continue-discontinue problems and extend to THM coupling.In this study,we extended the 3D-NMM to simulate both steady-state and transient heat conduction problems.The modelling was carried out using the raster methods(RSM).For the system equation,a variational method was employed to drive the discrete equations,and the crucial boundary conditions were solved using the penalty method.To solve the boundary integral problem,the face integral of scalar fields and two-dimensional simplex integration were used to accurately describe the integral on polygonal boundaries.Several numerical examples were used to verify the results of 3D steady-state and transient heat-conduction problems.The numerical results indicated that the 3D-NMM is effective for handling 3D both steady-state and transient heat conduction problems with high solution accuracy.

three-dimensional numerical manifold methodtransient analysisheat conduction problemGalerkin variationsimplex integration

TONG DeFu、YI XiongWei、TAN Fei、JIAO YuYong、LIANG JiaWei

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Faculty of Engineering,China University of Geoscience,Wuhan 430074,China

Department of Civil Engineering,Monash University,Melbourne VIC 3800,Australia

Badong National Observation and Research Station of Geohazards,China University of Geoscience,Wuhan 430074,China

国家自然科学基金国家自然科学基金国家自然科学基金Fundamental Research Funds for the Central Universities,China University of Geosciences,WuhanFundamental Research Funds for the Central Universities,China University of Geosciences,WuhanNational Overseas Study Fund

422771654192010400741731284CUGCJ1821CUGDCJJ202234202106410040

2024

10.1007/s11431-022-2321-9

中国科学:技术科学(英文版)
中国科学院

中国科学:技术科学(英文版)

CSTPCDEI
影响因子：1.056
ISSN：1674-7321
年,卷(期)：2024.67(4)
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