首页|Forced boiling of nonazeotropic immiscible mixture in a supercapillary microchannel array for ultra-high heat flux removal with chip junction temperature below 85℃

Forced boiling of nonazeotropic immiscible mixture in a supercapillary microchannel array for ultra-high heat flux removal with chip junction temperature below 85℃

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In this study,a structure-optimized two-phase microchannel heat sink with sintered submicron nucleation sites was developed and tested.The copper-based microchannels had a rectangular cross-section with an equivalent hydraulic diameter of 222 pm.The subcooled flow boiling characteristics were comprehensively compared between pure HFE-7100 and a non-azeotropic,immiscible binary mixture of HFE-7100 and water,considering heating areas of 1 and 5 cm.The total heating power input to the test section were 100-1500 and 250-3000 W for a 1 and 5 cm2 heat source,respectively,with a flow rate ranging from 50 to 150 L/h.Compared to pure HFE-7100,the non-azeotropic immiscible binary mixture of HFE-7100/water in the sintered porous microchannels exhibited a much higher overall heat transfer coefficient and lower power consumption.To maintain the junction temperature of a high power electronic chip below 85℃,the proposed supercapillary microchannel heat sink could effectively dissipate the heat flux of 1275 W/cm2 over 1 cm2 heat source and 500 W/cm2 over 5 cm2 heat source.In addition,the volume ratio of the binary mixture strongly influence the two-phase flow heat transfer characteristics.An optimal volume ratio exist in terms of the thermal resistance-pumping power minimization(HFE-7100:water=2:8 is recommended in this study).The findings of this investigation on the flow boiling properties of non-azeotropic immiscible mixtures help fill a gap in the related field.

microchannelsintered powder coatingsubmicron nucleation cavitiesnonazeotropic immiscibleultra-high heat flux

SUN Bo、BAO YuChen、TIAN Tong、LI Ji

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School of Engineering Science,University of Chinese Academy of Sciences,Beijing 100049,China

Laboratory of Advanced Thermal Management Technologies,School of Engineering Science,University of Chinese Academy of Sciences,Beijing 100049,China

National Natural Science Foundation of China

51776195

2024

中国科学:技术科学(英文版)
中国科学院

中国科学:技术科学(英文版)

CSTPCDEI
影响因子:1.056
ISSN:1674-7321
年,卷(期):2024.67(5)