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Effects of surface energy and substrate on modulus determination of biological films by conical indentation

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Micro-/nano-indentation has become prevalent in evaluating the mechanical characteristics of biological samples,such as cells and tissues.However,the existing contact models describing conical indentation ignore the joint effects of surface energy and substrate,and consequently cannot accurately extract the Young's modulus of biological samples deposited on substrate.Through finite element methods,we examine the conical indentation of biological films on substrates while taking surface energy into account.Based on the dimensional analysis,the explicit relationship between load and indentation depth is achieved for films with their moduli varying from 0.001 to 100 times that of the substrate.If the classical Sneddon's model was employed to analyze the load-depth data,the measured modulus could reach 18 times the real modulus for films on harder substrates,but only 4％of the real modulus for films on softer substrates.Meanwhile,in micro-/nano-indentations,neglecting the contribution of surface energy would result in an overestimation of the Young's modulus of films depending on the contact size.The analytical expression provided here can be utilized to precisely deduce the mechanical characteristics of biological films deposited on substrate from the load and indentation depth data of a conical indentation.

biological filmsurface effectsubstrate effectindentation

DING Yue、LI Cheng-Ya、NIU XinRui、WANG Gang-Feng

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Department of Engineering Mechanics,SVL,Xi'an Jiaotong University,Xi'an 710049,China

Department of Mechanical Engineering,City University of Hong Kong,Hong Kong SAR 999077,China

National Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaChina Postdoctoral science FoundationGeneral Research Fund from the Research Grants Council of the Hong Kong Special Administrative Region

12102322123721002018M64097CityU 11302920

2024

10.1007/s11431-023-2588-7

中国科学:技术科学(英文版)
中国科学院

中国科学:技术科学(英文版)

CSTPCDEI
影响因子：1.056
ISSN：1674-7321
年,卷(期)：2024.67(6)