首页|Three-dimensional simulation of the coupled electromagnetic-mechanical responses in a no-insulation racetrack coil

Three-dimensional simulation of the coupled electromagnetic-mechanical responses in a no-insulation racetrack coil

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This study investigates the coupled behavior of the mechanical and electromagnetic responses of a high-temperature super-conducting(HTS)no-insulation(NI)racetrack coil.A three-dimensional(3D)equivalent circuit network model and mechanical model with nonlinear contact are incorporated into the coupled model.The stress and separation of adjacent turns under a high magnetic field are analyzed by considering the electromagnetic force and cooling process.The numerical results demonstrate that the straight and curved parts of the racetrack coil exhibit distinct mechanical behaviors.Under a strong external magnetic field,the separation between adjacent turns reduces the charging delay of the coil.The maximum stress occurs in the transition regions between the curved and straight parts.The straight part exhibits a larger rotation angle,while the separation regions between adjacent turns are relatively fewer in those parts.The curved part shows a higher proportion of separation regions in the steady stage.The different separation areas in the straight and curved parts also result in distinct turn-to-turn losses during the charging process.Subsequently,a comparative study is conducted on the influence of residual currents induced by discharging.Finally,the effects of overband and inner diameter on the separation behavior are investigated.

high-temperature superconducting coilcoupled electromagnetic-mechanical responsesseparation

LI DongKe、CHANG ZhiXiang、TANG YunKai、LIU DongHui、YONG HuaDong、ZHOU YouHe

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Key Laboratory of Mechanics on Disaster and Environment in Western China,Ministry of Education of China,Lanzhou University,Lanzhou 730000,China

Department of Mechanics and Engineering Sciences,College of Civil Engineering and Mechanics,Lanzhou University,Lanzhou 730000,China

2024

中国科学:技术科学(英文版)
中国科学院

中国科学:技术科学(英文版)

CSTPCDEI
影响因子:1.056
ISSN:1674-7321
年,卷(期):2024.67(11)