高性能芯片物理实现的关键因素
Key factors in the physical design of high-performance chips
樊凌雁 1黄灿坤 1朱志伟 1刘海銮 1马香媛1
作者信息
- 1. 杭州电子科技大学微电子研究院,杭州 310018
- 折叠
摘要
影响高性能芯片的物理设计涉及多个关键因素,文章分析了其中主要的5个因素:标准单元库、核心IP库、布局布线、制造工艺、物理设计与EDA工具/Foundry的协作优化.通过对基本情况介绍,当前行业情况分析等,剖析了影响高性能芯片设计及制造的核心因素,对高性能芯片未来需要重点发展的方向提出了一些探讨思路.
Abstract
The physical design of high-performance chips is influenced by multiple critical factors.This paper analyzes five main factors:standard cell library,intellectual property(IP)library,place and route,manufacturing process,and collaborative optimization of physical design with electronic design automation(EDA)tools/Foundry.Through an introduction to the fundamental aspects and an analysis of the current industry situation,this study explores the core elements that impact the design and manufacturing of high-performance chips.Furthermore,it provides insights into future directions that need to be emphasized in the development of high-performance chips.
关键词
高性能芯片/物理设计/集成电路IP核/EDA/布局布线Key words
high-performance chips/physical design/intellectual property core/EDA/place and route引用本文复制引用
基金项目
国家自然科学基金(U22A2071)
浙江省软科学重点项目(2023C25023)
浙江省万人计划项目(2020R52019)
出版年
2024
NETL
NSTL
万方数据