从SoC到SDSoW:微电子发展的新范式
From SoC to SDSoW:a new paradigm for microelectronics development
邬江兴 1刘勤让 1沈剑良 1吕平 1宋克 1张帆 1李沛杰 1陈艇 1刘冬培 1张汝云 2李顺斌 2高彦钊 1魏帅 1张文建 1赵博 1郭威 1虎艳宾 1祁晓峰 1董春雷 1于洪 1张丽 1张霞 1裴雪 1赵豪兵 1李智超 1刘文斌1
作者信息
- 1. 信息工程大学信息技术研究所,郑州 450002
- 2. 之江实验室,杭州 311121
- 折叠
摘要
微电子在智能时代正迎来新一轮技术与产业的重大变革期.本文从智能时代的科学方法论、系统集成的工程技术路线和微电子摩尔定律(Moore's law)的维度扩展3个层面导入,提出了网络极大化节点极小化的复杂巨系统构造、异构异质芯粒的晶上拼装集成、硬件资源的领域专用软硬件协同定义,形成了软件定义晶上系统的新发展范式,对微电子的设计方法、系统集成、应用开发、经济性指标等进行了内涵升级,可全面刷新信息基础设施的技术物理形态,贡献一条"晶圆级硅基直连"的系统集成工程技术路线,并有望打造出智能涌现的物理底座.
Abstract
Microelectronics is ushering in a new round of significant technological and industrial changes in the intelligence era.This article starts the discussion from three dimensions:scientific methodologies,the engineering road of system integration,and Moore's law of microelectronics.A new development paradigm for the software-defined system-on-wafer(SDSoW)was formed by integrating heterogeneous dielet on a wafer system,developing a hardware-software codesign mechanism for a domain-specific system and being a complex giant system with network maximization and node minimization.The upgraded connotation among chip design,system integration,application development,and economic evaluation of microelectronics will completely refresh the technical and physical form of information infrastructure and contribute a"Silicon-based Wafer-level connection"system integration engineering route,which is expected to create a physical base for intelligent emergence.
关键词
片上系统/软件定义互连/软件定义晶上系统/异质异构/热压键合/软硬件协同Key words
system on chip(SoC)/software defined interconnection(SDI)/SDSoW/heterogeneous architecture/thermal compress bonding(TCB)/hardware and software coordination引用本文复制引用
基金项目
国家重点研发计划(2022YFB4401401)
之江实验室(2021LE0AC01)
出版年
2024
NETL
NSTL
万方数据