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从SoC到SDSoW:微电子发展的新范式

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微电子在智能时代正迎来新一轮技术与产业的重大变革期。本文从智能时代的科学方法论、系统集成的工程技术路线和微电子摩尔定律(Moore's law)的维度扩展3个层面导入,提出了网络极大化节点极小化的复杂巨系统构造、异构异质芯粒的晶上拼装集成、硬件资源的领域专用软硬件协同定义,形成了软件定义晶上系统的新发展范式,对微电子的设计方法、系统集成、应用开发、经济性指标等进行了内涵升级,可全面刷新信息基础设施的技术物理形态,贡献一条"晶圆级硅基直连"的系统集成工程技术路线,并有望打造出智能涌现的物理底座。
From SoC to SDSoW:a new paradigm for microelectronics development
Microelectronics is ushering in a new round of significant technological and industrial changes in the intelligence era.This article starts the discussion from three dimensions:scientific methodologies,the engineering road of system integration,and Moore's law of microelectronics.A new development paradigm for the software-defined system-on-wafer(SDSoW)was formed by integrating heterogeneous dielet on a wafer system,developing a hardware-software codesign mechanism for a domain-specific system and being a complex giant system with network maximization and node minimization.The upgraded connotation among chip design,system integration,application development,and economic evaluation of microelectronics will completely refresh the technical and physical form of information infrastructure and contribute a"Silicon-based Wafer-level connection"system integration engineering route,which is expected to create a physical base for intelligent emergence.

system on chip(SoC)software defined interconnection(SDI)SDSoWheterogeneous architecturethermal compress bonding(TCB)hardware and software coordination

邬江兴、刘勤让、沈剑良、吕平、宋克、张帆、李沛杰、陈艇、刘冬培、张汝云、李顺斌、高彦钊、魏帅、张文建、赵博、郭威、虎艳宾、祁晓峰、董春雷、于洪、张丽、张霞、裴雪、赵豪兵、李智超、刘文斌

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信息工程大学信息技术研究所,郑州 450002

之江实验室,杭州 311121

片上系统 软件定义互连 软件定义晶上系统 异质异构 热压键合 软硬件协同

国家重点研发计划之江实验室

2022YFB44014012021LE0AC01

2024

中国科学F辑
中国科学院,国家自然科学基金委员会

中国科学F辑

CSTPCD北大核心
影响因子:1.438
ISSN:1674-5973
年,卷(期):2024.54(6)