原子层制造的研究现状与科学挑战
Current Status and Scientific Challenges of Atomic Layer Manufacturing
钱林茂 1陈蓉 2朱利民 3赵德文 4彭小强 5周平 6邓辉 7余家欣 8曹坤 2杜春阳 5武恩秀 9江亮 1石鹏飞 1陈磊1
作者信息
- 1. 西南交通大学机械工程学院,成都 610031
- 2. 华中科技大学机械科学与工程学院,武汉 430074
- 3. 上海交通大学机械与动力工程学院,上海 200040
- 4. 清华大学机械工程系,北京 100084
- 5. 国防科技大学人工智能学院,长沙 410073
- 6. 大连理工大学机械工程学院,大连 116081
- 7. 南方科技大学机械与能源工程系,深圳 518055
- 8. 西南科技大学制造过程测试技术教育部重点实验室,绵阳 621010
- 9. 天津大学精密测试技术及仪器全国重点实验室,天津 300072
- 折叠
摘要
原子层制造是指加工精度达到原子层量级的可控制造技术,包括原子层去除、添加、迁移等.针对信息、能源、航空航天等领域核心零部件超高性能构建的发展需求,通过原子层可控去除制造全频段原子级精度无损表面,并结合原子层增材制造原子级新结构,有望实现特殊功能的有效创成,保证超高性能的安全可靠.另外,后摩尔时代先进芯片的制造工艺将迈入亚纳米物理极限,原子层制造需求贯穿芯片制造工艺的全流程.本文阐述了原子层制造技术的发展需求与研究进展,围绕原子层抛光、原子层沉积/刻蚀、原子层损伤控制、原子层工艺与装备等领域,梳理了原子层制造的发展方向及研究目标,凝练了原子层制造领域未来的关键科学问题及面临的挑战,探讨了前沿研究方向和发展战略.
Abstract
Atomic layer manufacturing(ALM)is a controllable technology with a processing accuracy at atomic layer level,which involves atomic layer removal,atomic layer addition,atomic layer migration,and other processes.In response to the development needs of ultra-high performance construction in the fields such as information,energy and areospace,it is necessary to produce atomic accuracy non-destructive surface in the whole frequency domain through atomic layer controllable removal.It is expected to achieve effective creation of special functions and ensure the safety and reliability of ultra-high performance applications combining with the creation of new atomic level structures.Furthermore,the manufacturing process of advanced chips in the post-Moore era will face the sub-nanometer physical limit,almost all chip manufacturing processes need ALM technology.One the one hand,the surfaces of chip substrate and interconnection structure must be polished to be with atomic level global flatness and surface accuracy.On the other hand,it must develop atomic layer additive manufacturing to fabricate the feature sizes as small as one or several atomic layer thicknesses,finally matching nanoscale linewidth chip manufacturing.This paper reviews the development needs and research progress of ALM technology,focusing on the fields of atomic layer polishing,deposition/etching,damage control,technology,and equipment,and summarizes the development direction and research objectives of ALM,as well as the key scientific issues and challenges faced in the future of ALM.
关键词
原子层制造/原子层抛光/原子层沉积/刻蚀/原子层损伤控制/原子层制造工艺与装备Key words
atomic layer manufacturing/atomic layer polishing/atomic layer deposition/etching/atomic layer damage control/atomic layer manufacturing process and equipment引用本文复制引用
基金项目
国家自然科学基金项目(52235004)
国家自然科学基金项目(51991373)
国家自然科学基金项目(52122507)
出版年
2024
NETL
NSTL
万方数据