Two-Dimensional Information Materials and Devices for Advanced Integrated Circuits
With the development of integrated circuit technology to the 3 nm node,Moore's law approaches its physical limits,and the chip process faces the theoretical bottlenecks including materials and devices.Two-dimensional information materials by virtue of atomic layer thickness,low power consumption and other advantages are considered to be the core materials of 1 nm and below nodes and to help the chip process to advance Moore's law continually,being closely related to the long-term planning of advanced manufacture process of integrated circuits in China.Based on the discussions and the proposals from the 343rd Shuangqing Forum,this paper reviews the development history of two-dimensional information materials and devices from the perspective of material-device-heterogeneous integrations.Furthermore,this paper also gives a discussion about the major key issues and challenges in this field in the next 5～10 years as well as the potential frontier research directions recommended to National Natural Science Foundation of China for funding.
two-dimensional information materialsdevicesintegrated circuitsfundamental researchscientific issues
万方数据
维普
