中国科学基金2024,Vol.38Issue(4) :612-621.

面向集成电路先进制程的二维信息材料与器件

Two-Dimensional Information Materials and Devices for Advanced Integrated Circuits

高鸿钧 张跃 施毅 王欣然 于志浩 施阁 唐华 何杰 刘克
中国科学基金2024,Vol.38Issue(4) :612-621.

面向集成电路先进制程的二维信息材料与器件

Two-Dimensional Information Materials and Devices for Advanced Integrated Circuits

高鸿钧 1张跃 2施毅 3王欣然 3于志浩 4施阁 5唐华 5何杰 5刘克5
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作者信息

  • 1. 中国科学院物理研究所,北京 100190
  • 2. 北京科技大学前沿交叉科学技术研究院,北京 100083
  • 3. 南京大学电子科学与工程学院,南京 210023
  • 4. 南京邮电大学集成电路学院,南京 210003
  • 5. 国家自然科学基金委员会信息科学部,北京 100085
  • 折叠

摘要

随着集成电路技术的发展至3nm节点,摩尔定律接近其物理极限,传统芯片制程面临材料到器件的理论和技术瓶颈.二维信息材料凭借原子层厚度、低功耗等特性被产业界认为是1 nm及以下节点的核心材料,将助力芯片制程延续摩尔定律以及平面到三维的发展,与我国集成电路先进制程长期规划紧密相关.基于国家自然科学基金委员会第343期双清论坛,本文从材料—器件—异质集成多层次回顾了二维信息材料与器件的发展历史,总结了领域内所面临挑战,凝炼了未来5~10年的重大关键科学以及亟需布局的研究方向,进一步提出顶层设计的前沿研究方向和科学基金资助战略.

Abstract

With the development of integrated circuit technology to the 3 nm node,Moore's law approaches its physical limits,and the chip process faces the theoretical bottlenecks including materials and devices.Two-dimensional information materials by virtue of atomic layer thickness,low power consumption and other advantages are considered to be the core materials of 1 nm and below nodes and to help the chip process to advance Moore's law continually,being closely related to the long-term planning of advanced manufacture process of integrated circuits in China.Based on the discussions and the proposals from the 343rd Shuangqing Forum,this paper reviews the development history of two-dimensional information materials and devices from the perspective of material-device-heterogeneous integrations.Furthermore,this paper also gives a discussion about the major key issues and challenges in this field in the next 5~10 years as well as the potential frontier research directions recommended to National Natural Science Foundation of China for funding.

关键词

二维信息材料/器件/集成电路/基础研究/科学问题

Key words

two-dimensional information materials/devices/integrated circuits/fundamental research/scientific issues

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出版年

2024
中国科学基金
国家自然科学基金委员会

中国科学基金

CSTPCDCSCD北大核心
影响因子:0.62
ISSN:1000-8217
参考文献量78
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