钼及钼合金板材再结晶显微组织与性能的研究
Recrystallization Microstructure and Properties of Molybdenum and Molybdenum Alloy Plates
郭雪琪 1申坤瑞 1郭鑫晴 1赵虹淳1
作者信息
- 1. 安泰天龙钨钼科技有限公司,天津 301800
- 折叠
摘要
研究了Mo、MoLa、Mo-50W 3 种板材的再结晶显微组织及其性能.结果表明:MoLa板再结晶退火温度比Mo板高100℃,Mo-50W板再结晶退火温度比Mo板提高了 400℃;Mo-50W板硬度值明显高于MoLa板,MoLa板与Mo板对比硬度值变化不明显;钼及钼合金板的抗拉强度均随着退火温度的升高而不断降低.
Abstract
Recrystallization microstructure and properties of Mo,MoLa and Mo-50W were studied.The results show that the annealing temperature of MoLa plate is 100℃higher than that of Mo plate,and the annealing temperature of Mo-50W plate is 400℃higher than that of Mo plate;the hardness value of Mo-50W plate is significantly higher than that of MoLa plate,and the contrast change of MoLa plate and Mo plate is not obvious;the tensile strength of molybdenum and molybdenum alloy plate is constantly decreasing with the increase of annealing temperature.
关键词
再结晶/金相组织/力学性能Key words
recrystallizing/microstructure/properties引用本文复制引用
出版年
2024
国家科技期刊平台
NSTL
万方数据