首页|钼及钼合金板材再结晶显微组织与性能的研究

钼及钼合金板材再结晶显微组织与性能的研究

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研究了Mo、MoLa、Mo-50W 3 种板材的再结晶显微组织及其性能.结果表明:MoLa板再结晶退火温度比Mo板高100℃,Mo-50W板再结晶退火温度比Mo板提高了 400℃;Mo-50W板硬度值明显高于MoLa板,MoLa板与Mo板对比硬度值变化不明显;钼及钼合金板的抗拉强度均随着退火温度的升高而不断降低.
Recrystallization Microstructure and Properties of Molybdenum and Molybdenum Alloy Plates
Recrystallization microstructure and properties of Mo,MoLa and Mo-50W were studied.The results show that the annealing temperature of MoLa plate is 100℃higher than that of Mo plate,and the annealing temperature of Mo-50W plate is 400℃higher than that of Mo plate;the hardness value of Mo-50W plate is significantly higher than that of MoLa plate,and the contrast change of MoLa plate and Mo plate is not obvious;the tensile strength of molybdenum and molybdenum alloy plate is constantly decreasing with the increase of annealing temperature.

recrystallizingmicrostructureproperties

郭雪琪、申坤瑞、郭鑫晴、赵虹淳

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安泰天龙钨钼科技有限公司,天津 301800

再结晶 金相组织 力学性能

2024

中国钼业
金堆城钼业集团有限公司 陕西省有色金属学会 中国有色金属工业协会钼业分会

中国钼业

CSTPCD
影响因子:0.481
ISSN:1006-2602
年,卷(期):2024.48(5)
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