中国物理B(英文版)2024,Vol.33Issue(6) :238-245.DOI:10.1088/1674-1056/ad342c

Interplay between topology and localization on superconducting circuits

关欣 霍炳燕 陈刚
中国物理B(英文版)2024,Vol.33Issue(6) :238-245.DOI:10.1088/1674-1056/ad342c

Interplay between topology and localization on superconducting circuits

关欣 1霍炳燕 1陈刚2
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作者信息

  • 1. Department of Materials and Chemical Engineering,Taiyuan University,Taiyuan 030032,China
  • 2. State Key Laboratory of Quantum Optics and Quantum Optics Devices,Institute of Laser Spectroscopy,Shanxi University,Taiyuan 030006,China;Collaborative Innovation Center of Extreme Optics,Shanxi University,Taiyuan 030006,China;School of Physics,Zhengzhou University,Zhengzhou 450001,China
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Abstract

Topological insulators occupy a prominent position in the realm of condensed matter physics.Nevertheless,the pres-ence of strong disorder has the potential to disrupt the integrity of topological states,leading to the localization of all states.This study delves into the intricate interplay between topology and localization within the one-dimensional Su-Schrieffer-Heeger(SSH)model,which incorporates controllable off-diagonal quasi-periodic modulations on superconducting circuits.Through the application of external alternating current(ac)magnetic fluxes,each transmon undergoes controlled driving,enabling independent tuning of all coupling strengths.Within a framework of this model,we construct comprehensive phase diagrams delineating regions characterized by extended topologically nontrivial states,critical localization,and co-existing topological and critical localization phases.The paper also addresses the dynamics of qubit excitations,elucidating distinct quantum state transfers resulting from the intricate interplay between topology and localization.Additionally,we propose a method for detecting diverse quantum phases utilizing existing experimental setups.

Key words

topology/localization/superconducting circuits

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基金项目

山西省自然科学基金(202103021223010)

出版年

2024
中国物理B(英文版)
中国物理学会和中国科学院物理研究所

中国物理B(英文版)

CSTPCDEI
影响因子:0.995
ISSN:1674-1056
参考文献量51
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