首页|Three-dimensional crystal defect imaging by STEM depth sectioning

Three-dimensional crystal defect imaging by STEM depth sectioning

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One of the major innovations awaiting in electron microscopy is full three-dimensional imaging at atomic resolution.Despite the success of aberration correction to deep sub-ångström lateral resolution,spatial resolution in depth is still far from atomic resolution.In scanning transmission electron microscopy(STEM),this poor depth resolution is due to the limitation of the illumination angle.To overcome this physical limitation,it is essential to implement a next-generation aberration corrector in STEM that can significantly improve the depth resolution.This review discusses the capability of depth sectioning for three-dimensional imaging combined with large-angle illumination STEM.Furthermore,the statisti-cal analysis approach remarkably improves the depth resolution,making it possible to achieve three-dimensional atomic resolution imaging at oxide surfaces.We will also discuss the future prospects of three-dimensional imaging at atomic resolution by STEM depth sectioning.

atomic-resolution STEMSTEM depth sectioningdepth resolutiondopantssurface topography

Ryo Ishikawa、Naoya Shibata、Yuichi Ikuhara

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Institute of Engineering Innovation,The University of Tokyo,Bunkyo,Tokyo 113-8656,Japan

JST-PRESTOJST-FORESTJST-ERATOKAKENHI JSPSKAKENHI JSPSKAKENHI JSPS"Next Generation Electron Microscopy"social cooperation program at the University of Tokyo

JP-MJPR1871JPMJFR2033JPMJER2202JP19H05788JP21H01614JP24H00373

2024

10.1088/1674-1056/ad4ff9

中国物理B(英文版)
中国物理学会和中国科学院物理研究所

中国物理B(英文版)

CSTPCDEI
影响因子：0.995
ISSN：1674-1056
年,卷(期)：2024.33(8)