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双金属复合板固?液铸轧复合轧制力模型

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基于传统双辊铸轧工艺,提出双金属复合板固−液铸轧成形轧制力模型.假设凝固点(KP)以下为固−固复合区,忽略液相区的变形抗力,并依此推导计算公式.通过建立二维热−流耦合模拟为模型中的参数提供取值依据,计算不同铸轧速度下制备Cu/Al复合板的轧制力.同时,通过实验验证该模型的可靠性,并获得轧制速度、基板厚度和材料对轧制力的影响规律.结果表明,轧制力随轧制速度的增加而减小,随基板厚度和导热系数的增加而增大.轧制力与KP高度相关,因此,制定合理的工艺参数控制KP高度对铸轧成形的稳定性具有重要意义.
Cast-rolling force model in solid−liquid cast-rolling bonding (SLCRB) process for fabricating bimetal clad strips
Based on twin-roll casting, a cast-rolling force model was proposed to predict the rolling force in the bimetal solid−liquid cast-rolling bonding (SLCRB) process. The solid−liquid bonding zone was assumed to be below the kiss point (KP). The deformation resistance of the liquid zone was ignored. Then, the calculation model was derived. A 2D thermal−flow coupled simulation was established to provide a basis for the parameters in the model, and then the rolling forces of the Cu/Al clad strip at different rolling speeds were calculated. Meanwhile, through measurement experiments, the accuracy of the model was verified. The influence of the rolling speed, the substrate strip thickness, and the material on the rolling force was obtained. The results indicate that the rolling force decreases with the increase of the rolling speed and increases with the increase of the thickness and thermal conductivity of the substrate strip. The rolling force is closely related to the KP height. Therefore, the formulation of reasonable process parameters to control the KP height is of great significance to the stability of cast-rolling forming.

bimetal clad stripsolid−liquid cast-rolling bondingrolling force calculation modelkiss pointthermal−flow coupled simulation

张俊鹏、黄华贵、赵日东、冯淼、孟凯

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燕山大学国家冷轧板带装备及工艺工程技术研究中心,秦皇岛 066004

燕山大学机械工程学院,秦皇岛 066004

双金属复合板 固−液铸轧复合 轧制力计算模型 凝固点 热−流耦合模拟

authors are grateful for the financial supports from the National Natural Science Foundation of ChinaDistinguished Young Fund of Natural Science Foundation of Hebei Province,China

51974278E2018203446

2021

10.1016/S1003-6326(21)65524-3

中国有色金属学报(英文版)
中国有色金属学会

中国有色金属学报(英文版)

CSTPCDCSCDSCI
影响因子：1.183
ISSN：1003-6326
年,卷(期)：2021.31(3)
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