Smart-microstructures of composites for electrical contacts with frameless packing of Cr and W in copper
W45Cu55, Cr65Cu35, and Cr32W14Cu54 alloys were obtained in order to study the mechanism of "smart response" of the structure of these alloys when using them as arc-resistant circuit-breakers. These alloys differ from industrial ones with frameless packing of Cr and W phases in the copper matrix. The alloy production method is based on the infiltration of copper melt into a mixture of non-compacted Cr and W powders under vibration exposure (80 Hz). The research results show an increase in the arc resistance of contacts when changing from "frame" packing of W to "frameless," as well as the decisive role of Cr in the processes of self-dispersion of arc-resistant phases and passivation of W and Cu. Based on the obtained results, conclusions are drawn about the advantage of frameless packing of arc-resistant phases in copper and the reasons for the "smart behavior" of the structure of Cr-containing contacts in response to functional loads in the presence of oxygen and an inert atmosphere.
NETL
NSTL
万方数据
维普
