首页|高温退火对Cu?0.15Zr合金显微组织和性能的影响

高温退火对Cu?0.15Zr合金显微组织和性能的影响

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采用快速凝固与热锻相结合的方法,制备组织均匀、晶粒细小的Cu−0.15Zr(质量分数,％)合金,研究高温退火过程中合金显微组织演变、力学性能和电导率.该合金表现出良好的热稳定性,即使在700℃退火2 h后,合金强度仅轻微下降.退火过程中纳米级连续分布的Cu5Zr析出相对位错运动起到钉扎作用,从而使基体强化,同时,尺寸较大的颗粒状Cu5Zr析出相通过钉扎晶界阻碍晶粒长大.在700℃退火2 h后,由于空位、位错、晶界以及基体中溶质Zr原子减少,合金电导率达到峰值88％(IACS).
Effect of elevated-temperature annealing on microstructure and properties of Cu−0.15Zr alloy
Cu−0.15Zr (wt.％) alloy with uniform and fine microstructure was fabricated by rapid solidification followed by hot forging. Evolution of microstructure, mechanical properties and electrical conductivity of the alloy during elevated-temperature annealing were investigated. The alloy exhibits good thermal stability, and its strength decreases slightly even after annealing at 700 ℃ for 2 h. The nano-sized Cu5Zr precipitates show significant pinning effect on dislocation moving, which is the main reason for the high strength of the alloy. Additionally, the large-size Cu5Zr precipitates play a major role in retarding grain growth by pinning the grain boundaries during annealing. After annealing at 700 ℃ for 2 h, the electrical conductivity of samples reaches the peak value of 88％ (IACS), which is attributed to the decrease of vacancy defects, dislocations, grain boundaries and Zr solutes.

Cu−Zr alloyrapid solidificationannealingmicrostructuretensile strengthelectrical conductivity

张子辰、王日初、彭超群、冯艳、王小锋、吴翔、蔡志勇

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中南大学 材料科学与工程学院,长沙 410083

中南大学 电子封装与先进功能材料湖南省重点实验室,长沙 410083

长沙理工大学 材料科学与工程学院,长沙 410114

Cu−Zr合金 快速凝固 退火 显微组织 抗拉强度 电导率

authors are grateful for the financial supports from the Ministry of Science and Technology of China

2017YFB0305701

2021

10.1016/S1003-6326(21)65763-1

中国有色金属学报(英文版)
中国有色金属学会

中国有色金属学报(英文版)

CSTPCDCSCDSCI
影响因子：1.183
ISSN：1003-6326
年,卷(期)：2021.31(12)
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