Interfacial structures and their effect on thermal conductivity and mechanical properties of diamond/Cu-B composites
Different interfacial structures of diamond/Cu composites were synthesized by varying the boron(B)content.The microstructural,thermal,and mechanical properties of the composites were investigated.The results showed that diamond/Cu-B composites had a high thermal conductivity of 695 W/(m·K)and high bending strength of 535 MPa attributed to the formation of a micron-scale dentate B4C interface structure.The dentate B4C provided dual functions of metallurgical bonding and mechanical meshing for interface bonding.A semi-coherent interface was formed between the diamond and B4C,where the diamond(111)and B4C(104)planes were parallel.The micro/nano-scale dentate structure improved the phonon transmission efficiency and bonding strength at the interface.
metal matrix composites(MMCs)diamond/Cu compositesthermal conductivityinterfacial structures
谢忠南、郭宏、肖伟、张习敏、黄树晖、孙明美、解浩峰
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有研科技集团有限公司有色金属结构材料制备加工国家重点实验室,北京 100088
有研工程技术研究院有限公司,北京 101407
北京有色金属研究总院,北京 100088
金属基复合材料 金刚石/铜复合材料 热导率 界面结构
National Key Research and Development Program of China
万方数据
维普
