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激光辅助低压冷喷涂Cu涂层的显微组织和腐蚀性能

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采用激光辅助低压冷喷涂(LPCS)方法制备Cu涂层,研究激光辐照对Cu涂层显微组织和腐蚀行为的影响.与LPCS-Cu涂层相比,激光辅助LPCS-Cu涂层更致密,涂层与基材的界面结合更好.激光辐照加大了沉积颗粒的整体塑性变形程度,使Cu沉积颗粒晶粒得到均匀细化.因此,激光辅助LPCS-Cu涂层呈更均匀的显微组织和更小的晶粒尺寸.电化学测试结果表明,激光辅助LPCS-Cu涂层在3.5%NaCl(质量分数)溶液中比LPCS-Cu涂层具有更高的腐蚀电位、更低的腐蚀电流和腐蚀速率.主要原因是激光辐照提高了涂层致密度和颗粒之间的紧密结合,并在激光辅助LPCS-Cu涂层表面形成由CuCl和Cu2O组成的连续、致密的腐蚀产物膜,以阻挡腐蚀溶液的侵蚀.
Micro structure and corrosion properties of Cu coatings deposited via laser-assisted low-pressure cold spray
Cu coatings were prepared via the laser-assisted low-pressure cold spray(LPCS)method to study the effect of laser irradiation on microstructure and corrosion behaviors of the coatings.The results reveal that the laser-assisted LPCS-Cu coatings are denser and have better coating-substrate interfacial bonding as compared to LPCS-Cu coating.Laser irradiation improves the overall plastic deformation of deposited particles,resulting in uniform grain refinement of Cu particles.Therefore,the laser-assisted LPCS-Cu coatings show more uniform microstructure and smaller grain size.The results of electrochemical tests demonstrated that laser-assisted LPCS-Cu coatings have higher corrosion potential,lower corrosion current and corrosion rate than the LPCS-Cu coating in 3.5 wt.%NaCl solution.The main reason is that laser irradiation improves the coating density and intimate bonding between particles,and a continuous and dense corrosion product film composed of CuCl and Cu2O is formed on the surface of the laser-assisted LPCS-Cu coating to block the erosion of the corrosive solution.

Cu coatinglaser irradiationcold spraymicrostructurecorrosion properties

吴丽娟、林钟卫、罗准、李波、刘江、张群莉、姚建华

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浙江工业大学机械工程学院,杭州 310023

浙江工业大学激光先进制造研究院,杭州 310023

浙江工业大学高端激光制造设备协同创新中心,杭州 310023

浙江热刺激光技术有限公司,台州 317500

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Cu涂层 激光辐照 冷喷涂 显微组织 腐蚀性能

National Natural Science Foundation of ChinaNatural Science Foundation of Zhejiang Province,ChinaFundamental Research Funds for the Provincial Universities of Zhejiang,China

52075495LY22E050017RF-A2020009

2024

中国有色金属学报(英文版)
中国有色金属学会

中国有色金属学报(英文版)

CSTPCD
影响因子:1.183
ISSN:1003-6326
年,卷(期):2024.34(2)