首页|加压氧化过程中胡敏酸结构和吸附特性的变化

加压氧化过程中胡敏酸结构和吸附特性的变化

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从碳质加压氧化金矿中提取胡敏酸.采用元素分析、傅里叶转换红外光谱、紫外-可见光光谱、拉曼光谱和X射线光电子能谱分析胡敏酸的结构.建立胡敏酸吸附金的动力学和等温线模型,计算热力学参数和等量吸附热.结果表明,受加压氧化的影响,胡敏酸的脂肪族结构、C=O键及其他含氧基团被破坏.更重要地,胡敏酸结构中有新化学键形成,如C—O—Clx、C—Clx和Me4N—Cl.吸附实验结果显示,加压氧化对胡敏酸的金吸附性能具有极大影响.加压氧化后,胡敏酸对纯金溶液的吸附率下降至(42.78±1.05)%,对金浸出液的吸附率下降至(28.63±1.11)%.吸附数据表明,胡敏酸对金吸附行为符合伪二级动力学和Langmuir等温线模型.胡敏酸的等量吸附热随吸附量的增加而增加.
Variations in structure and adsorption characteristics of humic acid during pressure oxidation process
Humic acid extraction from carbonaceous pressure-oxidized gold ore was carried out.The structure of humic acid was analyzed utilizing elemental analysis,FTIR,UV-Vis,Raman spectra and XPS.Also,the kinetic and isotherm models of the gold-adsorbing process were established to calculate the thermodynamic parameters and isosteric heat of adsorption.The results showed that affected by pressure oxidation,the aliphatic structure,C=O and other oxygen-containing groups were destroyed.Most importantly,new bonds,such as C—O—Clx,C—Clv and Me4N—Cl,were formed in the humic acid extracted from pressure-oxidized gold ore.The adsorption test results showed that,pressure oxidation made a profound impact on the gold-adsorbing performance of humic acid.The adsorption rate of humic acid decreased to(42.78±1.05)%for the pure gold solution and(28.63±1.11)%for the gold leaching solution after pressure oxidation.Adsorption findings conformed to the pseudo-second-order and Langmuir isotherm models.The isosteric adsorption heat of humic acid increased with the increase of the adsorption amount.

humic acidorthogonal experimentpressure oxidationstructural changeadsorption behavior

牛会群、赵荣欣、杨洪英、佟琳琳、周有勤

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东北大学多金属共生矿生态化冶金教育部重点实验室,沈阳 110819

东北大学冶金学院,沈阳 110819

山东黄金集团焦家金矿,莱州 264100

Joe Zhou Mineralogy Ltd.,Peterborough,Ontario K9L 2A6,Canada

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胡敏酸 正交实验 加压氧化 结构变化 吸附行为

国家自然科学基金National Key Research &Development Program of ChinaNational Key Research &Development Program of China

522743482018YFC19020022018YFC1902001

2024

中国有色金属学报(英文版)
中国有色金属学会

中国有色金属学报(英文版)

CSTPCD
影响因子:1.183
ISSN:1003-6326
年,卷(期):2024.34(5)